-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Orbotech to Showcase its Nuvogo 1000 DI and Sprint 200 Solutions at productronica
November 10, 2015 | OrbotechEstimated reading time: 1 minute
At productornica this week, ORBOTECH LTD is exhibiting its recently launched, high accuracy Nuvogo™ 1000 Direct Imaging (DI) system which significantly enhances quality, production throughput and TCO and Sprint 200, the fast, high precision PCB legend inkjet printer.
Orbotech’s Nuvogo 1000 DI solution brings high accuracy and fast throughput to demanding patterning, solder mask and flex solder mask applications. Utilizing a high-power laser and Orbotech’s unique MultiWave Laser Technology, the Nuvogo 1000 delivers small undercut and excellent side walls. The high depth-of-focus achieved by field-proven Orbotech Large Scan Optics (LSO) technology ensures unmatched quality on the most challenging surface topographies. The system also offers advanced scaling modes for high precision registration, and a dual table mechanism to optimize imaging time.
When describing the Nuvogo 1000, Albert Angel, General Manager of Lab Circuits, a Spanish PCB manufacturer specializing in Quick Turnaround (QTA), said “With the Nuvogo 1000, our throughput increased by more than 65% on solder mask applications while maintaining the desired level of quality. Since one shift was eliminated, we also achieved significant cost savings.”
Powered by Orbotech DotStream Pro Technology, the new Sprint 200 delivers cost-effective, top quality industrial legend inkjet printing. It enables consistently accurate high volume production of even the most advanced legend designs on a wide range of substrate thicknesses and types, including rigid or flex. The Sprint 200 achieves close to 90% one-pass production coverage, significantly more than other leading solutions.
“Orbotech has always been committed to bringing innovative, cost-effective, high-quality solutions to Europe’s PCB manufacturers,” said Hadar Himmelman, Orbotech West President. “At Productronica 2015, our new Nuvogo 1000 DI and Sprint 200 Inkjet systems further demonstrate this commitment.“
Orbotech will also show other state-of-the-art PCB production solutions including the Fusion 22 Automated Optical Inspection (AOI) system and Frontline PCB Solutions’ CAM and Engineering software at Productronica show in Munich, Hall B1, Booth #321.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device is produced using Orbotech technology. For more information, visit www.orbotech.com
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.