Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
Arlon’s John Wright Discusses New High-Performance Materials
November 11, 2015 | Real Time with...productronicaEstimated reading time: Less than a minute
During productronica, European Editor Pete Starkey interviewed Engineering/Quality Manager John Wright of Arlon. They discussed Arlon’s new 85HP ceramic-filled polyimide, as well as a non-woven aramid material, suitable for space applications, that is a drop-in replacement for a similar material discontinued by a competitor in 2006.
To watch this interview, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
MVTec, Siemens Expand Technological Cooperation
06/12/2025 | MVTecMVTec Software GmbH and Siemens are expanding their technological cooperation in the field of industrial automation. To reinforce their increasingly close collaboration, Siemens joined the MVTec Technology Partner Program in May 2025.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in