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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
July 28, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Bill brings with him a wealth of experience in Essemtec’s advanced equipment and technology. His seven years of expertise in the PCBA market will provide further support to our customers in identifying effective application solutions and addressing challenges in their manufacturing processes.
Essemtec, a leading manufacturer of dispensing, jetting, and placement equipment, offers a range of innovative products, including the PUMA 2 —an all-in-one solution ideal for New Product Introduction (NPI) applications and small production runs. This system allows manufacturers to test and validate new designs without disrupting ongoing production lines.
During a recent visit to San Jose for mid-year meetings, the PCBA Sales Team at Technica had the opportunity to meet and welcome Bill to the region and discuss collaborative initiatives aimed at enhancing customer support and engagement.
Jason Perry, President of Technica USA, stated: “We are excited to have Bill based in the Bay Area to work alongside our team to provide application support and demonstrations for our customers. With the
PUMA 2 and TARANTULA systems now installed in our San Jose Demo Center, and Bill’s technical knowledge on hand, we anticipate an increase of interest in conducting demonstrations of Essemtec’s many solutions.”
Bill will be working out of the Technica San Jose facility until the completion of the new Nano-Dimension San Jose office and applications lab.
Contact Yannick Green, ygreen@technica.com, of Technica or Frank Santos, Frank.Santos@nano-di.com, to arrange your private demonstration.
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Technica Announces Tech Day Event Dates and Agenda
04/13/2026 | Technica USATechnica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
BTU Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region
04/08/2026 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026.
Technica and Supply Partners Participate in Dallas SMTA Expo & Tech Forum
04/07/2026 | Technica USAFor the second consecutive year, Technica USA participated in the Dallas SMTA Expo & Tech Forum, held Tuesday, April 7, at the Plano Event Center
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.