Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Polar Instruments Fine-Tunes Layer Stackup Management
November 16, 2015 | Pete Starkey, Real Time with...productronicaEstimated reading time: Less than a minute
Polar Instruments CEO Martyn Gaudion and Technical Editor Pete Starkey discuss Polar’s efforts to simplify specification issues related to the supply chain. Designing PCBs with mixed materials makes layer stackup management more difficult than ever, but Gaudion explains how Polar works closely with materials providers and CAD tool companies in order to provide users with constantly updated information.
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