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2015’s Most Read PCB News Items
June 7, 2016 | I-Connect007Estimated reading time: 2 minutes
Infineon Acquires 9.4% Stake in Schweizer Electronic
By investing into Schweizer, Infineon emphasizes its intention to jointly develop technologies for the integration of power semiconductors into PCBs and to tap the chip embedding market for high-power automotive and industrial applications.
Lenthor Achieves ISO 9001:2008 Re-certification
Lenthor Engineering, Inc. has successfully completed its corporate ISO 9001:2008 re-certification. The re-certification audit was performed at lenthor’s new 55k sq/ft corporate facilities in Milpitas, CA.
Isola Unveils New Technical Education Series
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit Boards (PCBs), today announced the launch of a new technical education Series (TES) to address the increasingly important role of laminate materials in the overall process of system-level design.
N.A. PCB Book-to-Bill Ratio Strengthens
“Although North American PCB sales continued slightly below last year’s levels in February, bookings strengthened,” said Sharon Starr, IPC’s director of market research, “This increased the bookto-bill ratio,” she added. “The ratio has been in positive territory for the past five months, which is a positive indicator for sales growth in the first half of 2015.”
Invotec Acquisition Strengthens Amphenol’s Global Capabilities
The acquisition of Invotec, one of the global leaders in flex and flex-rigid PCB manufacturing, strengthens Amphenol’s global capabilities and product offering in the defense, industrial and aerospace industries.
Sparton Acquires Hunter Technology Corporation
Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.
Key PCB Makers Strategize to Meet Industry Demands
The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Top industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.
Isola’s New Laminate Mitigates Skew in High Speed Designs
Isola Group today announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs.
IPC Honors Volunteers for Contributions to the Industry
IPC presented committee leadership, distinguished committee Service, and Special recognition awards at IPC APEX EXPO at Mandalay Bay convention center in Las Vegas, Nevada. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.