Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
It’s Only Common Sense: Trust Is All You Need
PNC Purchases Benchtop AOI
January 6, 2016 | PNCEstimated reading time: 1 minute
PNC, a provider of rigid, rigid-flex and flex PCBs, has boosted its capabilities by acquiring Nordson YESTECH’s BX Benchtop Automated AOI.
Nordson YESTECH’s advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. It inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
“Our goal is to always provide our customers the best quality on the market today so we are always ready to invest in quality assurance. This AOI inspection machine has already proven to be a great piece of equipment for us,” said Sam Sangani, President and owner of PNC.
About PNC
PNC located in Nutley, N.J. is one of the country’s leading providers of rigid, rigid-flex and flex printed circuit boards and the largest PCB supplier in the region. They are committed to providing their customers with innovative solutions for their PCB fabrication and assembly needs. They are committed to working side-by-side with visionary engineers and buyers in all technologies including High Frequency RF/ Microwave boards; Audio, Defense Aerospace and Medical. The dare to take on demanding and challenging technologies including R&D projects. They combine the latest technology with American Innovation to deliver world class printed circuit board solutions including Design, Fabrication and assembly to their customers.
For more information go to www.pnconline.com.
Share on:
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.