-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
PNC Purchases Benchtop AOI
January 6, 2016 | PNCEstimated reading time: 1 minute

PNC, a provider of rigid, rigid-flex and flex PCBs, has boosted its capabilities by acquiring Nordson YESTECH’s BX Benchtop Automated AOI.
Nordson YESTECH’s advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. It inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
“Our goal is to always provide our customers the best quality on the market today so we are always ready to invest in quality assurance. This AOI inspection machine has already proven to be a great piece of equipment for us,” said Sam Sangani, President and owner of PNC.
About PNC
PNC located in Nutley, N.J. is one of the country’s leading providers of rigid, rigid-flex and flex printed circuit boards and the largest PCB supplier in the region. They are committed to providing their customers with innovative solutions for their PCB fabrication and assembly needs. They are committed to working side-by-side with visionary engineers and buyers in all technologies including High Frequency RF/ Microwave boards; Audio, Defense Aerospace and Medical. The dare to take on demanding and challenging technologies including R&D projects. They combine the latest technology with American Innovation to deliver world class printed circuit board solutions including Design, Fabrication and assembly to their customers.
For more information go to www.pnconline.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.