Dan’s Bix Bookshelf: The Ten Faces of Innovation
It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Graphic Group Exhibiting at DesignCon Show
January 18, 2016 | Graphic GroupEstimated reading time: 1 minute
Graphic Group, a global manufacturer of high-technology printed circuit boards, will be exhibiting at the DesignCon Show, Santa Clara Convention Center, Santa Clara CA on January 20 & 21. Graphic will feature an assortment of complex Rigid, Rigid Flex, Flex Circuit and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
The DesignCon Show features over 160 elite vendors and is the largest meeting of board designers, and is the ONLY event to address chip design engineers' chip/system/package challenges. Attendees will discover and evaluate the latest high-speed design tools, technologies and developments in the chip, board and system design industry. Graphic Group will be located in Booth 1251.
Graphic Group is one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, Graphic focuses on leading edge technology released to the most demanding international quality standards.
Graphic is an expert at prototyping and developing new "first to market" products. With facilities in the UK, United States and in China for medium to large volume production, the Graphic Group is able to offer the complete service from Application Engineering support to volume PCB manufacture.
HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind vias, buried vias, blind micro-vias, copper filled micro-vias, resin filled vias, stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic.plc.uk, www.graphic-usa.com and www.rigidflex-graphic.com
Share on:
Suggested Items
ICT Spring Seminar: Nickel Not Welcome Here
03/12/2025 | Pete Starkey, I-Connect007After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.
Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
03/10/2025 | MulticircuitsMike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection
02/20/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
Designers Notebook: Addressing Future Challenges for Designers
02/06/2025 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.