-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Nippon Mektron, Orbotech Collaborate to Optimize Digital Flexible PCB Manufacturing
February 10, 2016 | OrbotechEstimated reading time: 1 minute
ORBOTECH LTD. today announced that Nippon Mektron Mektec, the world’s most dominant maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories. These systems will significantly improve current and future smartphone manufacturing by facilitating the creation of flex inspections and high-throughput production capability.
Flex PCB manufacturing, which is required to accommodate the rapidly expanding mobile phone market, will be supported by Orbotech’s Nuvogo™ DI systems, with state-of-the-art DI for patterning and solder mask applications, as well as Orbotech’s AOI systems for inspection. Nippon Mektron has worked closely with Orbotech’s local support teams to ensure consistent product performance and quick production ramp up throughout their factories in Japan, Thailand, China and Taiwan.
“From mobile phones and tablets to wearables and sophisticated automotive electronics, today’s electronics manufacturers are constantly being challenged to simplify designs, provide flexible packaging solutions and support ever-smaller devices,” said Yair Alcobi, President, Orbotech Asia East. “Through this very close collaboration, we are pleased to support Nippon Mektron’s current and future product performance requirements for flex PCB manufacturing processes and enable them to offer innovative and market-ready solutions.”
According to industry analyst firm Prismark Partners’ January 2016 Printed Circuit Report, the 2015/2014 year-on-year value growth estimate for flex PCBs increased by 6.2 percent in dollar value worldwide, which can be attributed to demand for smart and connected electronics and the need for high-speed communications in small and lightweight packages.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ: ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems.
For more information, click here.
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.