- 
                                  
- News
-  Books
                        Featured Books
- pcb007 Magazine
Latest IssuesCurrent Issue  The Legislative Outlook: Helping or Hurting?This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.   Advancing the Advanced Materials DiscussionMoore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.   Inventing the Future With SELTwo years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication. 
- Articles
- Columns
- Links
- Media kit||| MENU
- pcb007 Magazine
Advanced Copper Foil (ACF) to Display Full Line of Circuit Foil Copper Foils at IPC APEX 2016
March 8, 2016 | Advanced Copper FoilEstimated reading time: 1 minute
 
                                                                    Having signed an exclusive distribution agreement with Circuit Foil Luxemburg in 2015, ACF is now fully ready to provide value-added copper foil products to all regions of the United States and Canada.
ACF welcomes customers and will be exhibiting its full line of Circuit Foil Copper Foils and Aluminum Supported Copper Foils at the IPC/APEX Show in Las Vegas March 15-17, Booth 447.
Foils for the PCB Manufacturer
On display will be standard shiny foils, high bond/Polyimide foil, low loss, ultra-low loss and HVLP foils. There will be a complete display of LP, VLP, HVLP and foils with “Almost No Profile” (Rz ≤ 1.3um). ACF also offers a host of specialty foils for PTFE, Flexible Circuits, ultra-thin foils (≤ 2um) and foils specially designed for High Speed Low Loss Laminates.
Copper Foil with Aluminum Carrier
See both the AFC2, Single-sided Aluminum, and the ACF3, Double-sided Copper Aluminum Copper layers. Manufactured in a clean-room, the ACF family of products guarantee a pristine copper surface, free of debris and other foreign materials. These products also protect the copper surface from epoxy spots and finger prints during the Multilayer Layup process. The unique process, established with complete cleanliness in mind, does not require aluminum shearing during the manufacturing process as others products do. This in conjunction with our unique tooling and proprietary panel cleaning processes allows ACF to guarantee our customers the highest quality panels without the concern of aluminum particles or other foreign materials, with any tooling configuration required.
Special Shielding and Battery Foils
Complete line of foils for industrial markets such as battery and shielding, as well as our foils for PCB application.
About ACF
Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. ACF2 and ACF3 aluminum supported foils are products that facilitate the PCB layup process, improve efficiencies and provide a carrier for ultra-thin foils. We are committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today.
For further information visit: www.advancedcopperfoil.com
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    