The Shaughnessy Report: Back to the Future
Designers Notebook: Addressing Future Challenges for Designers
Connect the Dots: Designing for Reality—Surface Finish
PADS Paper: 10 Things to Know about Thermal Design
June 8, 2016 | Mentor GraphicsEstimated reading time: Less than a minute
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design.
Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronic products would fail in a matter of minutes. Leakage current, and thus leakage power, goes up with smaller die-level feature sizes.
Because leakage is temperature-dependent, thermal design is more important. How should engineers who develop products with complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, this PADS paper will take a look at 10 things you should know about thermal design of electronic products. To download this paper, click here.
Share on:
Suggested Items
EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities
02/18/2025 | Pete Starkey, I-Connect007“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”
J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
02/18/2025 | Marcy LaRont, I-Connect007Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.
Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry
02/18/2025 | BUSINESS WIRECambridge GaN Devices (CGD), a leading innovator in gallium nitride (GaN) power devices, has successfully closed a $32 million Series C funding round. The investment was led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital.
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
02/18/2025 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector. Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
KYZEN to Showcase Stencil Cleaning Research Advancements at IPC APEX EXPO 2025
02/17/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit in Booth 642 at the upcoming 2025 IPC APEX EXPO, scheduled for March 18-20, 2025 at the Anaheim Convention Center. Celebrating 35 years of innovation and continuous improvement, KYZEN will spotlight its industry-leading research and solutions designed to advance electronics manufacturing processes.