-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Signal Integrity Tools and Design Methodology in the Modern Age
August 15, 2016 | Dennis Nagle, Cadence Design SystemsEstimated reading time: 2 minutes
The PCB design process has traditionally been done in silos. One group creates the design intent (schematic), another group implements the logic on the PCB, and yet another group does some checking of the design using analysis tools. This traditional approach has run into a number of problems.
The first problem was that prototypes were showing up in the lab that did not work due to complicated signal and power integrity problems not found by the analysis tools. But even when the analysis team equipped themselves with sophisticated analysis tools, the back-and-forth between silos or lack of time in the schedule tended to create chaos as design deadlines loomed.
Today, modern PCB design methodology offers a more team-oriented solution. With a front-to-back constraint driven approach that enables all groups to get involved with signal and power integrity, many potential problems are either avoided or found early in the design process. With first order problems removed, the analysis team, with their sophisticated tools, is better positioned to focus on design sign-off so prototypes come back working the first time.
This article is focused on how each part of that design team can get out of their silo and work cooperatively. Using a common constraint manager, each group can utilize their varying levels of expertise to ferret out signal and power integrity problems.
Pre-Layout
For teams seeking to break out of their historic silos, tools can help by providing a certain amount of integration. One way that can happen is by having a constraint system integrated with your SI system at all stages of your design process. While decisions are being made for physical partitioning, component/IP selections, and power requirements, pre-layout analysis can help define your solution space and corresponding electrical constraints. This early analysis as part of a well-executed constraint driven flow saves time and prevents issues from propagating down to SI signoff.
Topology analysis is usually what comes to mind when thinking of pre-layout analysis and is an ideal environment for what-if analysis. Here you can start from scratch or by extracting nets from design data in the schematic or layout. In either case you can quickly build a representation of the major interfaces in the design. Models for active devices should be as accurate as possible and interconnect can be estimated or parameterized and swept.
To read this entire article, which appeared in the July 2016 issue of The PCB Design Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.