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Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability

10/21/2026 | Thuy Nguyen, Hongwen Zhang, PhD, Ronald C. Lasky, PhD, and Adam Murling, Indium
Solder joint voiding remains a critical reliability concern in electronic packaging, particularly for high-performance and safety-critical applications such as automotive electronics. Excessive voiding can adversely affect both thermal conductivity and mechanical strength, leading to elevated junction temperatures, accelerated fatigue failure under thermal cycling, and ultimately reduce product lifetime.

Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

Indium Halogen-Free Solder Paste Wins Mexico Technology Award

10/16/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies.

AIM Solder Signs New Distributor X5 Company in Brazil

10/16/2026 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of X5 Company as a new distributor in Brazil.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.
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