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SHENMAO to Present at 2016 IMPACT-IAAC Joint Conference in Taiwan
October 12, 2016 | SHENMAO Technology Inc.Estimated reading time: Less than a minute
SHENMAO Technology Inc. will present a paper on a formulated no clean flux for fine-pitch flip chip package of copper pillar/micro-bump interconnect at the upcoming 2016 IMPACT-IAAC Joint Conference, which will be held in conjunction with the TPCA Show 2016 on October 26–28, 2016 at the Taipei Nangang Exhibition Hall in Taiwan.
The paper, authored by Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, and Watson Tseng, will discuss in details about the applicability of a new no clean flux in fine-pitch flip chip interconnect from the point of view of flux formulations, including flux activity for wetting performance, rheological characterization for the study of behaviors during reflow process and the evaluation of compatibility with underfill.
For more information, contact SHENMAO Technology Inc. at +886-3-416-0177, e-mail solder@shenmao.com or visit www.shenmao.com.
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