-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Preventing the Big 7 Mistakes of SMT Assembly with Expert Phil Zarrow
October 19, 2016 | SMTAEstimated reading time: 1 minute
The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.
Phil Zarrow, a popular speaker and workshop instructor, will conduct “The Deadly Sins of SMT” workshop that identifies the “deadly sins” of SMT assembly, both for lead and lead-free processes. This will be an excellent course in the business of SMT by a nationally recognized expert.
Zarrow has chaired and instructed numerous seminars and conferences throughout North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles, as well as contributed a number of chapters to industry books.
Some of the topics covered include design for manufacturability: specification development; SMT implementation; SMT assembly and solder process failure analysis; manufacturing yield improvement; no-clean and lead-free paste evaluation and process implementation; and QFN, BGA, CSP, flip chip special considerations for the new components.
The meeting agenda is as follows:
- 3-3:15 p.m.: Meet & Greet - Snacks and beverages served
- 3:15 p.m.: Welcome by Michael Prestoy, Acting President of Philadelphia Chapter
- 3:20 p.m.: Welcome by SMTA HQ, Tanya Martin
- 3:30-4:30 p.m.: Presentation “The Deadly Sins of SMT” by Phil Zarrow, ITM Consulting
- 4:45 p.m.: Q&A and Wrap Up
The registration cost is $10 for members, $15 for non-members, and free for student members. Those who sign up as new members also will receive free admission. To register for the event, e-mail Karen Frericks at karenchapters@smta.org or click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.