Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Altus Joins Koh Young at electronica
October 24, 2016 | altuEstimated reading time: 1 minute
Altus Group, distributor of capital equipment for the electronics assembly industry in the UK and Ireland will join Koh Young at electronica, the world leading trade fair for electronic components, systems and applications being held in Munich from 8-11 November (Hall 1 booth 358).
There will be a number of systems presented at the exhibition including the Zenith full 3D AOI System which measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI. As the first true 3D AOI system ever developed, Zenith uses 2D and 3D information for better visualisation of the components and solder joints allowing a true comparison with the IPC-A-610 standard for inspection.
Richard Booth, managing director at Altus, said "As the principle distributor for Koh Young in the UK and Ireland we are looking forward to joining them at Electronica. It gives us the perfect opportunity to meet with existing and new customers and to understand their requirements in AOI inspection.
"Exhibitions like electronica also help us to understand and learn about all the latest innovations within the industry and gives us the opportunity to meet potential new suppliers."
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.