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October 31, 2016 EPA CDR Reporting Applies to Many Manufacturers
October 25, 2016 | IPCEstimated reading time: 1 minute
The deadline for complying with the U.S. Environmental Protection Agency (EPA) Chemical Data Reporting (CDR) rule is October 31, 2016.
Under EPA interpretation of the CDR regulations, manufacturers who send byproducts, such as wastewater treatment sludge, spent etchant or spent baths, for recycling may be required to report under the CDR because EPA views the byproduct stream as a new chemical because it is a feedstock to the recycling process. The applicability of the CDR reporting requirements depends on a number of factors including the amounts of specific chemicals in the byproduct.
For example, any printed circuit board manufacturer using ammonium chloride etchant in excess of approximately 784 gallons per year during 2102, 2013, 2014, or 2015 and sending the spent etchant for recycling is likely to exceed the 2,500 lb. reporting threshold for copper tetraammine chloride.
Recently, IPC achieved a long-sought goal with the inclusion of a requirement for EPA to reexamine this rule passage as part of the of The Frank R. Lautenberg Chemical Safety for the 21st Century Act amending TSCA, however this does not change the need to report this year.
For more information, please review our CDR guidance and TSCA CDR website. You may also contact Fern Abrams, IPC director of regulatory affairs at FernAbrams@ipc.org or +1 202 661-8092.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.