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October 31, 2016 EPA CDR Reporting Applies to Many Manufacturers
October 25, 2016 | IPCEstimated reading time: 1 minute
The deadline for complying with the U.S. Environmental Protection Agency (EPA) Chemical Data Reporting (CDR) rule is October 31, 2016.
Under EPA interpretation of the CDR regulations, manufacturers who send byproducts, such as wastewater treatment sludge, spent etchant or spent baths, for recycling may be required to report under the CDR because EPA views the byproduct stream as a new chemical because it is a feedstock to the recycling process. The applicability of the CDR reporting requirements depends on a number of factors including the amounts of specific chemicals in the byproduct.
For example, any printed circuit board manufacturer using ammonium chloride etchant in excess of approximately 784 gallons per year during 2102, 2013, 2014, or 2015 and sending the spent etchant for recycling is likely to exceed the 2,500 lb. reporting threshold for copper tetraammine chloride.
Recently, IPC achieved a long-sought goal with the inclusion of a requirement for EPA to reexamine this rule passage as part of the of The Frank R. Lautenberg Chemical Safety for the 21st Century Act amending TSCA, however this does not change the need to report this year.
For more information, please review our CDR guidance and TSCA CDR website. You may also contact Fern Abrams, IPC director of regulatory affairs at FernAbrams@ipc.org or +1 202 661-8092.
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Sweeney Ng - CEE PCBSuggested Items
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.