The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
SHENMAO America to Exhibit at MEPTEC
October 25, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
SHENMAO America Inc. will be showcasing its semiconductor packaging materials at the upcoming MEPTEC Semiconductor Packaging Roadmap Symposium, which will be held on November 14, 2016 at the Holiday Inn Silicon Valley San Jose in California.
SHENMAO is one of the world’s major provider of solder materials such as semiconductor packaging solder spheres, package-on-package solder paste, bumping solder paste, dipping flux, SMT solder paste, low and high temperature solder paste, solder preform, wave solder bar, solder wire and flux.
SHENMAO America will be at Booth 17.
For more information, please contact SHENMAO America Inc. at +1-408-943-1755 or e-mail usa@shenmao.com.
Share on:
Suggested Items
A New Dispensing Solder Paste for Laser Soldering Technology
07/20/2016 | Watson Tseng, et al., Shenmao America Inc.A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.
Shenmao America to Showcase Water Soluble Flux at the SEMICON West
07/11/2016 | SHENMAO America Inc.Shenmao America Inc. will introduce its SMF-WB02/SMF-WB51 Water Soluble Flux at the SEMICON West event happening this week (July 12–14) at the Moscone Center in San Francisco, California.
Shenmao America Intros BGA and Micro BGA Bumping Solder Paste as SEMICON West 2016
07/07/2016 | SHENMAO America Inc.Shenmao America will showcase its bumping solder paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) at the SEMICON West 2016 event happening from July 12–14 in San Francisco, California.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in