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Shenmao America Intros BGA and Micro BGA Bumping Solder Paste as SEMICON West 2016
July 7, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
Shenmao America Inc. will showcase its bumping solder paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) at the SEMICON West 2016 event happening from July 12–14 in San Francisco, California.
The PF608-PI-21 and PF606-P-BS1 aim to decrease voids in wafer bumping process. Shenmao Micro Material Institute applications engineers focused on developing the bumping solder paste formula with excellent stencil printing transfer rate and the lowest void to optimize manufacturing process performance.
The world’s largest IC packaging and test service OSAT utilizes Shenmao Bumping Solder Paste in production.
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