The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Shenmao America to Showcase Water Soluble Flux at the SEMICON West
July 11, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
Shenmao America Inc. will introduce its SMF-WB02/SMF-WB51 Water Soluble Flux at the SEMICON West event happening this week (July 12–14) at the Moscone Center in San Francisco, California.
The SMF-WB02/SMF-WB51 Water Soluble Flux features low viscosity, high tackiness, consistent printability for BGA and Micro BGA Ball Assemblies, and excellent wash ability after high temperature reflow (255°C and 60s over 220°C).
The SMF-WB02/SMF-WB51 Water Soluble Flux create highly reliable solder joints with optimum maximized quality.
Share on:
Suggested Items
SHENMAO America to Exhibit at MEPTEC
10/25/2016 | SHENMAO America Inc.SHENMAO America Inc. will be showcasing its semiconductor packaging materials at the upcoming MEPTEC Semiconductor Packaging Roadmap Symposium, which will be held on November 14, 2016 at the Holiday Inn Silicon Valley San Jose in California.
A New Dispensing Solder Paste for Laser Soldering Technology
07/20/2016 | Watson Tseng, et al., Shenmao America Inc.A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.
Shenmao America Intros BGA and Micro BGA Bumping Solder Paste as SEMICON West 2016
07/07/2016 | SHENMAO America Inc.Shenmao America will showcase its bumping solder paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) at the SEMICON West 2016 event happening from July 12–14 in San Francisco, California.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in