Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
BEST: Phil Zarrow to Teach SMT Assembly Boot Camp in Chicago
October 25, 2016 | BEST Inc.Estimated reading time: 1 minute
BEST has announced that renowned subject matter expert Phil Zarrow will be in Chicago teaching a 3 day course on SMT assembly November 29 through December 1, 2016.
This class is for those wanting to get a high-level view of SMT assembly and have their questions answered by an instructor with decades of experience and expertise in the field of board assembly. Engineers who are new to this field, applications engineers employed by device manufacturers, and PCB designers would do well to spend three days in this seminar/tour-formatted class.
The class will be both theoretical and practical, with local tours and demonstration augmenting the learning. As in all of his classes, Zarrow will include a mix of war stories, funny anecdotes and real-world experiences.
The outline of the class is:
- Introduction
- PCB fab
- Solder paste
- Stencil design
- Printing parameters
- Component placement
- Overview of the placement process in SMT tour
- Analysis of the reflow process and profiling
- Wave soldering
- Cleaning and cleanliness testing
- Testing
In addition students will be invited along for local tours of a PCB fab, stencil fab, x-ray and ICT/flying probe testing facility.
About Phil Zarrow
Zarrow is a popular speaker and workshop instructor and is the principal of ITM Consulting, an SMT process consulting firm. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books including "SMT Glossary-Terms and Definitions." Zarrow holds two US patents concerning PCB fabrication and assembly processes and audit methodologies.
About Business Electronics Soldering Technologies (BEST)
Headquartered in Rolling Meadows, Illinois, BEST is a master IPC-certified solder and wire harness training center certifying students and instructors in IPC-A-620, J-STD-001, IPC-A-610 and IPC 7711/21. In addition, BEST is a supplier of PCB rework and repair services as well as tools for those services in the communications, computer, industrial, automotive, avionic and military sectors.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.