-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
BEST: Phil Zarrow to Teach SMT Assembly Boot Camp in Chicago
October 25, 2016 | BEST Inc.Estimated reading time: 1 minute
BEST has announced that renowned subject matter expert Phil Zarrow will be in Chicago teaching a 3 day course on SMT assembly November 29 through December 1, 2016.
This class is for those wanting to get a high-level view of SMT assembly and have their questions answered by an instructor with decades of experience and expertise in the field of board assembly. Engineers who are new to this field, applications engineers employed by device manufacturers, and PCB designers would do well to spend three days in this seminar/tour-formatted class.
The class will be both theoretical and practical, with local tours and demonstration augmenting the learning. As in all of his classes, Zarrow will include a mix of war stories, funny anecdotes and real-world experiences.
The outline of the class is:
- Introduction
- PCB fab
- Solder paste
- Stencil design
- Printing parameters
- Component placement
- Overview of the placement process in SMT tour
- Analysis of the reflow process and profiling
- Wave soldering
- Cleaning and cleanliness testing
- Testing
In addition students will be invited along for local tours of a PCB fab, stencil fab, x-ray and ICT/flying probe testing facility.
About Phil Zarrow
Zarrow is a popular speaker and workshop instructor and is the principal of ITM Consulting, an SMT process consulting firm. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books including "SMT Glossary-Terms and Definitions." Zarrow holds two US patents concerning PCB fabrication and assembly processes and audit methodologies.
About Business Electronics Soldering Technologies (BEST)
Headquartered in Rolling Meadows, Illinois, BEST is a master IPC-certified solder and wire harness training center certifying students and instructors in IPC-A-620, J-STD-001, IPC-A-610 and IPC 7711/21. In addition, BEST is a supplier of PCB rework and repair services as well as tools for those services in the communications, computer, industrial, automotive, avionic and military sectors.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.