Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Leo Lambert Discusses EPTAC’s Evolving Mission
November 7, 2016 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
This month we’ve been dealing with challenges related to being a great manager and a great leader. One of the biggest problems a manager faces is training—getting employees trained, and keeping them current on constantly changing technologies. I asked Leo Lambert, VP and CTO of EPTAC, what his thoughts were on the subject of leadership, and more specifically, what strategies EPTAC embraces with regard to training—both initial and ongoing.
Andy Shaughnessy: Leo, please give us a quick background on EPTAC and the training you provide.
Leo Lambert: EPTAC is a certified IPC training center, and we train to all the IPC programs, including IPC-A-600, IPC-A-610, J-STD-001, WHMA/IPC-A-620, IPC-7711/7721, and IPC-6012. We hold these classes all over the country and in our local facility in Manchester, New Hampshire. We are the largest training center supplying IPC training to the industry.
We offer and sell training materials to support our customers who train their own personnel and conduct webinars on a monthly basis, discussing current topics within our industry. We answer customers’ questions in our Solder Tips section and believe this Q&A is really helpful to the industry. Our Ask Helena & Leo section allows anyone to ask questions related to electronic manufacturing and more. We also provide news about the latest things happening within the industry and within EPTAC itself.
Shaughnessy: Have your training methods evolved over time?
Lambert: Our offerings to the industry include a manual soldering program, along with an advance manual soldering program dealing with 0402, 0201 and 01005 component sizes. This program is modified at the request of our customers to fit their needs.
We also have incorporated additional workmanship programs to the IPC 610 and 620 programs where we teach the students how to inspect the product and physically build a cable with the appropriate crimps and strip lengths.
Additionally, we’ve developed workshops designed for engineers and supervisors to provide them with a quick look at the standards, so that they can understand the content and intent of the programs.
Shaughnessy: How has the curriculum itself changed?
Lambert: The curriculum is always changing based upon the existing and changing technology in tooling, materials, products and documentation. We don’t normally focus on the computer skills necessary to run the equipment, but from what I’ve seen on the manufacturing floor, the skill levels needed are to troubleshoot the equipment when the unit malfunctions or stops. The operators are trained to read the screens, selecting the various programs to be run depending upon the product, and to get in touch with maintenance if a major deviation occurs.
To read this entire article, which appeared in the October 2016 issue of The PCB Design Magazine, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.