-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Alpha to Present on New Tin Applications at ITRI Asia Tin Summit
November 15, 2016 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will present on consumption and new tin applications at the ITRI Asia Tin Week, which will be held from November 21–24 in Shanghai, China.
"Changes of Tin Application in Electronics Assembly Industry" will be presented November 23 by Valentijn Van Velthoven, Regional Vice President of Asia Pacific for Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses.
"Considering the change of macro environments, I would like to present the link between the macro trends we see in our everyday world and how they impact solders, how they are being used, what drives the markets, and ultimately, how they affect demand for solder and alloys," said Valentijn. His presentation will specifically focus on photovoltaic, power electronics and LED industries.
Asia Tin Week, organized by the global tin association, ITRI, comprises of two main formal sessions: the ITRI Asia Tin Summit focused on industry and market issues and the China International Solder Technology Forum. Both sessions are simultaneously translated in both English and Mandarin. This is the 4th ITRI event held in China following 2011 in Hangzhou, 2013 in Kunming and 2015 in Shanghai. With strong support from other world leading organizations, this event will provide a comprehensive forum for discussion and networking between members of the global tin industry.
To learn more about Alpha and our commitment to Conflict Free Minerals, visit AlphaAssembly.com. For more information about this event, please visit AsiaTinWeek.com.
- Asia Tin Week
- 21-24 November 2016
- Sheraton Shanghai Hongqiao Hotel
- 5 Zunyi Nan Road, Shanghai, 200336, China
- Asia Tin Summit, Session 4 – Consumption and New Tin Applications
- Date: 23 November, 2016
- Time: 09:30 – 10:00 am
- Topic: Changes of Tin Application in the Electronic Assembly Industry
- Speaker: Valentijn Van Velthoven
About Industrial Technology Research Institute (ITRI)
Industrial Technology Research Institute (ITRI) is a nonprofit R&D organization engaging in applied research and technical services, aiming to innovate a better future. Founded in 1973, ITRI has been dedicated to helping industries stay competitive and sustainable.
ITRI has played a vital role in Taiwan's economic growth as it shifted from a labor-intensive industry into a value-added, innovation-driven one. Moving forward, the institute will continue serving as a pioneer for industries by strengthening its capabilities of multidisciplinary innovation and cooperation with international partners all over the world.
ITRI continues to seek strategic collaborative partners from around the world.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.