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Alpha Introduces New Lead-Free, No-Clean Solder Pastes
November 17, 2016 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions is introducing new lead-free, no clean solder paste technologies, the ALPHA OM-353 and the ALPHA OM-535.
ALPHA OM-353 is an ultra-fine feature print and air reflow-capable solder paste that is ideal for assemblies sensitive to component warpage or processes that require cleaning. It has been tested to give excellent printing performance down to 180µm pad size.
ALPHA OM-535 is a low temperature paste with excellent drop shock resistance and electrical reliability for low temperature reflow applications. It produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.
"These pastes were developed to meet new printing challenges and performance demands," said Traian Cucu, Global Product Manager for Solder Paste at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. "Each has unique assets to quell reliability concerns. OM-353 has excellent transfer efficiency with small area ratios and ensures high pick-and-place yields and good self-alignment. The enhanced properties of low temperature SBX02 alloy combined with the advanced chemistry performance of OM-535 enables the formation of a better solder joint by improving the mechanical performance and cosmetics using low temperature process settings."
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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