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Nordson Launches ASYMTEK Vantage XL for Panel-Level Packaging

08/25/2026 | BUSINESS WIRE
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

Nordson Electronics to Demo Wafer & Panel Packaging Systems at SEMICON China

03/12/2026 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall N2), in the Shanghai New International Expo Centre, March 25-27, 2026.

Rehm Showcases Future Technologies for Electronics Manufacturing Live at APEX EXPO 2026

02/11/2026 | Rehm Thermal Systems
Rehm Thermal Systems will present current solutions for conformal coating and dispensing, resource-efficient vapor phase soldering, and nitrogen reflow soldering. Visit us at booth 942 and experience our technologies live on site.

Essemtec Launches the Tarantula Dual Lane – Endless Versatility in Dispensing and Jetting

11/12/2025 | Essemtec
Essemtec proudly introduces the Tarantula Dual Lane, our most advanced dispensing platform designed to redefine flexibility, speed, and scalability in modern electronics production.
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