Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
SMTA Names Hutchins Grant Award Winner
November 23, 2016 | SMTAEstimated reading time: 1 minute
During the 2016 Annual Meeting at SMTA International, the SMTA announced that Kate Reeve, a graduate student at Purdue University, has been selected as the recipient of the 2016 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys."
Reeve expects to graduate from Purdue University with her Ph.D. in May of 2018, after which she plans to pursue a career in academics, conducting research and teaching within topics of materials science. Reeve graduated from Iowa State University in 2013 with a bachelor's degree in Materials Engineering and dual minors in Nuclear Engineering and Economics.
The Charles Hutchins Educational Grant, co-sponsored by the SMTA and Circuits Assembly magazine, was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The $5000 grant has been presented annually since 1998 to a full time graduate-level student pursuing a degree and working on thesis research in electronics assembly, electronics packaging, or a related field.
The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, Illinois, September 25–29. The 2017 grant will be presented at SMTAI in Rosemont, Illinois, September 17–21, 2017.
View details here. Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.