-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
EIT Partners with MIRTEC for Outstanding Performance and 3D Defect Detection
December 6, 2016 | MirtecEstimated reading time: 1 minute

EIT, LLC has selected MIRTEC’s MV-6 OMNI 3D AOI machine based on outstanding performance and 3D defect detection capability.
“Established in 1977, EIT, LLC has been providing high quality manufacturing and box-build assemblies to our customers in the medical, industrial, communications, defense and aerospace markets for over 40 years. Throughout the years, there have been two constants in our business; dedicated hard-working employees and change. Today, EIT is certified to AS 9100, ISO 13485 and ISO 9001 and we continue to evolve as a company. As part of our continuing change and process improvement initiatives, we have implemented MIRTEC’s MV-6 3D OMNI AOI system into our manufacturing process. The performance and defect detection capabilities of this system have proven to be outstanding! We are very pleased to have MIRTEC as a partner in our manufacturing processes,” stated David Faliskie, president and COO of EIT, LLC.
“We, at MIRTEC, understand that Electronic Manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much needed competitive edge in this highly competitive industry,” said Brian D’Amico, president of MIRTEC Corp. “With this in mind, an increasing number of manufacturers are relying upon 3D Automated Optical Inspection (AOI) equipment to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded EIT’s 3D AOI business. We look forward to a long and prosperous relationship between our two organizations.”
MIRTEC’s award-winning MV-6 OMNI 3D AOI machines are configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection System which combines 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D System to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-6 OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please click here.
For more information about EIT, LLC, please click here.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.