Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
SiSoft Discusses AMI Modeling at DesignCon 2017
January 30, 2017 | SiSoftEstimated reading time: 1 minute
Signal Integrity Software Inc. will present multiple sessions focused on AMI modeling at DesignCon 2017. DesignCon will take place at the Santa Clara Convention Center January 31-Feb 2, 2017.
Tuesday:
"AMI Model Development from SerDes Design - a Practical Approach"
Tutorial presented with MathWorks:
January 31 / 1:30pm - 4:30pm
"Getting the Most from IBIS-AMI: Tips and Secrets from the Experts"
Technical panel: January 31 / 4:45pm -6:00pm
Wednesday:
"A Beginner's Guide to SerDes and AMI Modeling"
This 40 minute sponsored session is being presented with MathWorks:
February 1 / 10:15-10:55am
Mission City M1
About SiSoft
SiSoft collaborates with customers and their suppliers to develop innovative solutions to the world’s toughest high-speed design problems. SiSoft accelerates design cycles through a combination of award-winning EDA simulation software, methodology training and consulting services. Quantum Channel Designer (QCD) is the Industry’s Premier Channel Simulator for the design and analysis of Multi-Gigabit serial links and a DesignVision Award Winner. Quantum-SI (QSI) is the leading solution for integrated signal integrity, timing and crosstalk analysis of high-speed parallel interfaces. SiSoft’s products automate comprehensive pre- and post-route analysis of high-speed interfaces, detailing a design’s operating voltage and timing margins. More information on SiSoft can be found here.
About DesignCon
DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
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