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Laser Photonics Propels R&D Efforts in Wafer Marking

02/04/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.

EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/04/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

EXTOLL Collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/03/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

LITEON+, LITEON Startup Platform, Expands International Partner Ecosystem

02/03/2025 | LITEON Technology
LITEON Technology announced that the "LITEON+ Startup Platform" has formed an alliance with "Plug and Play Japan," one of the world's largest accelerators/venture capitals. This collaboration focuses on the "Deep Tech" theme, leveraging each other's startup ecosystems to introduce teams specializing in energy, sustainability, and AI.
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