-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Cibel Chooses Frontline PCB Solutions' InCAM as Its Leading CAM Solution
April 11, 2017 | OrbotechEstimated reading time: 2 minutes

Orbotech has announced that Cibel has chosen InCAM as its preproduction CAM solution to replace its Genesis2000 CAM operation. Developed by Frontline PCB Solutions, InCAM is a comprehensive CAM system that performs fast, high-precision CAM tooling, via powerful design-for-manufacturing tools.
“Since migrating from Genesis 2000 to InCAM, we’ve noticed improved analysis speeds due to InCAM’s multi-processing capabilities. We can begin reviewing analysis results for the first layer while other layer analyses run in the background, dramatically shortening cycle time,” said Christophe JOYAU, Cibel General Director. “Integration is smoother in InCAM, not only with Frontline’s engineering products (InPlan and InStack) but with the entire Windows environment, and there is seamless backwards compatibility with Genesis 2000. In addition, all-round improved functionality – pad stacks, profile with holes etc.– enables significantly faster job processing.”
“We are very pleased with Cibel’s decision to migrate to InCAM®,” said Claudio Bellistri, CAM and Engineering Business Manager, Orbotech Europe. “InCAM’s dedicated DFM and analysis tools, Check & Fix, and system-wide automation enable operators to achieve unparalleled quality and accuracy, helping manufacturers meet production challenges in a collaborative and secure work environment. These benefits have driven a growing trend of migration from Genesis to InCAM.”
About InCAM
InCAM® is a comprehensive, innovative CAM system for HDI and IC Packaging PCB manufacturers that combines editing and analysis with automatic design-for-manufacture optimization to perform high-precision CAM tooling, with maximum efficiency and speed - helping manufacturers achieve lasting profitability and a competitive edge. InCAM® supports yield growth by enabling operators to multi-task and run advanced processes in the background, using the computer's multi-core CPU capabilities. Cycle time is dramatically shortened as colleagues team up on jobs in a data-secure, collaborative environment. InCAM® delivers improved data integrity and fault indication by allowing interactive post processing on selected DFM results. In addition, InCAM® operators can enjoy a streamlined user interface and remarkably easy-to-use tools. In addition, backwards compatibility with Genesis 2000, for both data and automation, drives productivity even further.
About Cibel
Founded in 1986, Cibel has forged an undeniable reputation in the manufacture of printed circuits: prototypes, small and medium scale batches. Cibel’s products have been used with great success by industrial majors in such varied fields as semiconductors, avionics, defense, telecommunications, medical, research and general industry, as well as by specialized technological niches. Cibel had built up its expertise over the years by bringing together complementary skills -"tailor-made expertise"as it were. Through a carefully developed strategy in terms ofinvestmentandorganization, Cibel has obtained the certifications necessary to serve the most demanding markets.
About Orbotech
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components.
Virtually every electronic device is produced using Orbotech technology. For more information visit www.orbotech.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.