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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Mentor Paper: DDR4 Board Design and Signal Integrity Verification Challenges
May 17, 2017 | Craig Armenti, Mentor GraphicsEstimated reading time: Less than a minute
This Mentor white paper, originally presented at DesignCon and nominated for a best paper award, includes an investigation of DDR4's Pseudo Open Drain driver and what its use means for power consumption and Vref levels for the receivers.
This paper also examines a DDR4 system design example and the need for simulating with IBIS power aware models versus transistor level models for Simultaneous Switching Noise characterization.
To download this paper, click here.
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American Standard Circuits Launches 50th 77-Second Webinar
10/27/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone Circuits is pleased to announce that they have recently unveiled their 50th 77-second webinar.
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Zuken Announces ZIW Americas 2026 in Dallas
10/21/2025 | ZukenZuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.