-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Launches ‘The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs – Part 2’ Micro eBook
May 18, 2017 | I-Connect007Estimated reading time: 1 minute

I-Connect007 has released the second book in our micro eBook design series authored by Polar Instruments: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2.”
The Printed Circuit Designer’s Guide to…is an ongoing series of micro eBooks specifically dedicated to the education of PCB designers. This book series will become the gold standard for people seeking the most relevant design information available.
The latest title in this new line of eBooks, The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2, is authored by Martyn Gaudion of Polar Instruments. In this edition, Gaudion examines issues such as laminate loss, differential insertion loss, impedance control, modelled vs. measured results, and much more.
“Martyn Gaudion has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging eBook,” says Happy Holden.
This book is a must-read, not just for designers, but for anyone involved with high-speed PCBs: purchasing agents, salespeople, marketing professionals, recent graduates, etc.
We welcome you to download this book for free by visiting here. You can find Part 1 of The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs and other titles in our eBook series by visiting our library at I-007eBooks.com.
Here are some other exciting titles in our micro eBook series:
- The Printed Circuit Buyer’s Guide to… AS9100 by Imagineering, Inc.
- The Printed Circuit Designer's Guide to… Design for Manufacturability (DFM) by Altium
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals by American Standard Circuits
- The Printed Circuit Designer's Guide to...Secrets of High-Speed PCBs - Part 1 by Polar Instruments
- The EMS Buyer’s Guide to… Procuring High-Complexity Electronics by Zentech—coming soon!
- The Printed Circuit Designer’s Guide to… Signal Integrity by Example – Part 1 and Part 2 by Mentor Graphics—coming soon!
- The Printed Circuit Assembler’s Guide to…Conformal Coating by Electrolube—coming soon!
We hope you enjoy The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs – Part 2.
For more information, contact:
Emmy Ross
I-Connect007 eBooks
+1.651.492.4427 (GMT-5)
Suggested Items
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
DuPont Announces Additional Leaders and Company Name for the Intended Spin-Off of the Electronics Business
04/29/2025 | PRNewswireDuPont announced Qnity Electronics, Inc. as the name of the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business.
Real Time with... IPC APEX EXPO 2025: Benmayor Group—Resistance is Futile: Automation Is the Future
04/11/2025 | Real Time with...IPC APEX EXPOJeff Brandman, president of Aismalibar North America, and Eduardo Benmayor, CEO of Benmayor Group, discuss Benmayor Group's role in electronics and automation, focusing on how automation addresses labor shortages. Jeff, notes that many businesses struggle to find workers for manual tasks, emphasizing the need for various automation solutions to boost productivity. North America lags in automation compared to other regions, which impacts efficiency. Jeff recommends a step-by-step approach to scaling automation, and there's growing acceptance of robots in the workforce, leading to a positive outlook for the future.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.