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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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14th Electronic Circuits World Convention
June 20, 2017 | Happy HoldenEstimated reading time: 8 minutes
Figure 9: KT action sequences. (Source: Happy Holden.)
Figure 10: Selecting the right statistical tool. (Source: the NIST Engineering Statistics Handbook.)
Figure 11: Automation strategy and methodology. (Source: Happy Holden.)
Figure 12: PCB fab automation software interactions. (Source: Happy Holden.)
“FPC Market and Related Technology Trend,” Hirofumi Matsumoto, Nippon Mektron
Nippon Mektron is considered to be the largest printed circuit fabricator in 2015, with ZenDing Technology a close rival. This invited talk highlighted the flex circuit segment of the PCB market:
- FPC market trends: The FPC market has grown by an average of 6.5% to $15.4B in 2015. It is expected to slow to 1.5% over the next seven years to $17.7B in 2022. Of that amount, $4.98B will be FPC assembly.
- FPC primary market and future markets: The mix has changed. In 2000, the applications were: mobile phone—22%, mobile camera—11%, hard discs—24%, digital audio—17%, packaging—13%, LCDS—5%, vehicle—4%, and optical—2%. In 2014, the distribution was: cellular phones—51%, LCD for phones—9%, camera for phones—4%, HDD—10%, automotive—9% computers—6%, cameras—6%, wearables—1% and other—4%
- Smartphone market and related FPC technologies (Figure 13): 17 different kinds of FPCs go into the smartphone and shipments exceeded 1.5 billion sets in 2016, growing to 1.84 billion by 2020 (Figure 14).
- Future FPC markets: The smartphone will continue to grow for medical, emergency, and other social network needs. Other growing markets will be automotive, virtual reality, drones, and IoT/M2M
- Wearable, 5G and IoT markets: These growing markets will demand new materials better suited to their performance and environment. Washable materials, ultra-high-speed films like LCP (30-300 GHz), and disposable film or harsh environment films.
Figure 13: Smartphone growth (updated 2016). (Source: Matsumoto.)
Figure 14: Smartphone flexible display trend. (Source: Matsumoto.)
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.