-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
14th Electronic Circuits World Convention
June 20, 2017 | Happy HoldenEstimated reading time: 10 minutes
Figure 9: KT action sequences. (Source: Happy Holden.)
Figure 10: Selecting the right statistical tool. (Source: the NIST Engineering Statistics Handbook.)
Figure 11: Automation strategy and methodology. (Source: Happy Holden.)
Figure 12: PCB fab automation software interactions. (Source: Happy Holden.)
“FPC Market and Related Technology Trend,” Hirofumi Matsumoto, Nippon Mektron
Nippon Mektron is considered to be the largest printed circuit fabricator in 2015, with ZenDing Technology a close rival. This invited talk highlighted the flex circuit segment of the PCB market:
- FPC market trends: The FPC market has grown by an average of 6.5% to $15.4B in 2015. It is expected to slow to 1.5% over the next seven years to $17.7B in 2022. Of that amount, $4.98B will be FPC assembly.
- FPC primary market and future markets: The mix has changed. In 2000, the applications were: mobile phone—22%, mobile camera—11%, hard discs—24%, digital audio—17%, packaging—13%, LCDS—5%, vehicle—4%, and optical—2%. In 2014, the distribution was: cellular phones—51%, LCD for phones—9%, camera for phones—4%, HDD—10%, automotive—9% computers—6%, cameras—6%, wearables—1% and other—4%
- Smartphone market and related FPC technologies (Figure 13): 17 different kinds of FPCs go into the smartphone and shipments exceeded 1.5 billion sets in 2016, growing to 1.84 billion by 2020 (Figure 14).
- Future FPC markets: The smartphone will continue to grow for medical, emergency, and other social network needs. Other growing markets will be automotive, virtual reality, drones, and IoT/M2M
- Wearable, 5G and IoT markets: These growing markets will demand new materials better suited to their performance and environment. Washable materials, ultra-high-speed films like LCP (30-300 GHz), and disposable film or harsh environment films.
Figure 13: Smartphone growth (updated 2016). (Source: Matsumoto.)
Figure 14: Smartphone flexible display trend. (Source: Matsumoto.)
Page 4 of 6
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.