-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
14th Electronic Circuits World Convention
June 20, 2017 | Happy HoldenEstimated reading time: 10 minutes
Figure 9: KT action sequences. (Source: Happy Holden.)
Figure 10: Selecting the right statistical tool. (Source: the NIST Engineering Statistics Handbook.)
Figure 11: Automation strategy and methodology. (Source: Happy Holden.)
Figure 12: PCB fab automation software interactions. (Source: Happy Holden.)
“FPC Market and Related Technology Trend,” Hirofumi Matsumoto, Nippon Mektron
Nippon Mektron is considered to be the largest printed circuit fabricator in 2015, with ZenDing Technology a close rival. This invited talk highlighted the flex circuit segment of the PCB market:
- FPC market trends: The FPC market has grown by an average of 6.5% to $15.4B in 2015. It is expected to slow to 1.5% over the next seven years to $17.7B in 2022. Of that amount, $4.98B will be FPC assembly.
- FPC primary market and future markets: The mix has changed. In 2000, the applications were: mobile phone—22%, mobile camera—11%, hard discs—24%, digital audio—17%, packaging—13%, LCDS—5%, vehicle—4%, and optical—2%. In 2014, the distribution was: cellular phones—51%, LCD for phones—9%, camera for phones—4%, HDD—10%, automotive—9% computers—6%, cameras—6%, wearables—1% and other—4%
- Smartphone market and related FPC technologies (Figure 13): 17 different kinds of FPCs go into the smartphone and shipments exceeded 1.5 billion sets in 2016, growing to 1.84 billion by 2020 (Figure 14).
- Future FPC markets: The smartphone will continue to grow for medical, emergency, and other social network needs. Other growing markets will be automotive, virtual reality, drones, and IoT/M2M
- Wearable, 5G and IoT markets: These growing markets will demand new materials better suited to their performance and environment. Washable materials, ultra-high-speed films like LCP (30-300 GHz), and disposable film or harsh environment films.
Figure 13: Smartphone growth (updated 2016). (Source: Matsumoto.)
Figure 14: Smartphone flexible display trend. (Source: Matsumoto.)
Page 4 of 6
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.