-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Proposed IEC Standard on Halogen-Free Raises Concerns
July 10, 2017 | IPCEstimated reading time: 1 minute
Like the game Whack-a-Mole, the idea of a standard for low-halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free.
Then about a decade ago, concerns about certain toxic bromine-containing flame-retardants (polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and concerns regarding incomplete combustion of PVC and bromine-containing plastics in electronics led to the passage of the EU WEEE Regulation and RoHS Directive which banned the toxic substances and mandated appropriate handling of waste electronics.
Despite the removal of any toxic halogen-containing compounds from the electronics supply chain, IPC and JEDEC members began discussions about the development of a standard for low halogen electronics. IPC, with its broad membership and open voting processes, never approved the low halogen standard, which was deemed to be a marketing tool posing as an environmental standard. JEDEC, with its narrower membership, went ahead and passed and published "Definition of 'Low Halogen' for Electronic Products” in 2015.
In 2016, the JEDEC standard was temporarily (up to six years) approved by IEC TC 111 (environmental standardization committee) as an IEC publicly available specification (PAS), despite the broad questions that were raised regarding technical validity. Revision and permanent adoption of the standard is now being considered by TC 111. The proposed revision would define electronics as “Low Halogen” when they “contain less than 0,9% (by mass) total elemental halogen content (F+Cl+Br+I) and meet the thresholds of all halogenated substances in IEC 91 62474 database." The proposed standard is concerning not just because of the content of the proposal, but by the labeling of low halogen as an environmental standard.
The standard is in the Committee Draft Phase which means it is being circulated for comments to all IEC TC111 member countries. The deadline for comment is September 15, 2017. If you are concerned, contact your country’s IEC National Committee and the IEC TC111 representatives.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.