Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Review of the 2017 IPC Reliability Forum
July 18, 2017 | Steve WilliamsEstimated reading time: 1 minute
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
Event Background
The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Dupriest, Michael Jawitz, Craig Hillman, Gary Ferrari, Jack Fisher, Denny Fritz, and Sanjay Huprikar, VP of the IPC Member Services. Mike Carano, VP of RPB Chemical Technologies, served as the forum’s ringleader, host and emcee. I was fortunate enough to have been asked to participate and speak at the event, and I feel an obligation to let those who were not able to attend this year know what an invaluable educational opportunity this ongoing forum presents for our industry moving forward.
The Audience
The forum was well attended, with a veritable who’s who of our industry’s supply chain, including raw material and equipment suppliers, PCB fabricators, contract manufacturers and OEMs. Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Electronic Material, DuPont–RTP, Embraer S.A., Extreme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, Intrinsiq Materials, Inventec Performance Chemicals, IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Control, MacDermid Enthone, MED-EL, Minco, Motorola, Nexteer Automotive, Northrop Grumman, NSWC Crane, NTS, Orbital, Park Electrochemical, Penn State University, Precision Analytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, RollsRoyce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON.
The Topics
The Steering Committee did a wonderful job of assembling a lineup of topics that were both relevant to the forum’s theme of manufacturing high-performance products, and presenting insight from our industry’s brightest technological minds. What follows is a brief highlight of each speaker’s presentation.
To read the full version of this article which appeared in the July 2017 issue of The PCB Magazine, click here.
Share on:
Suggested Items
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Jenoptik Fab Officially Inaugurated in Dresden
05/07/2025 | JenoptikJenoptik manufactures micro-optics for the semiconductor equipment industry in a state-of-the-art production environment.
Join the Conversation: MESI 4.0 Summit 2025 Brings Manufacturing Experts to Porto
05/06/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.