- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
SnapEDA Launches Instabuild, a Free Computer Vision-Based Part BuilderOctober 4, 2017 | SnapEDA
Estimated reading time: 1 minute
SnapEDA, the Internet’s first parts library for circuit board design, is launching InstaBuild, the first free automated part builder. InstaBuild uses powerful computer vision technology to enable PCB designers to make schematic symbols in mere minutes.
Using a datasheet as the input, it automatically extracts symbol pinouts, understands whether a pin is an input, output or power pin, and auto-arranges the symbols based on SnapEDA’s published symbol standards.
“InstaBuild is based on the underlying technology we use internally at SnapEDA to create parts quickly,” said Natasha Baker, CEO and founder of SnapEDA. “We’re opening up access so that hardware designers around the world can benefit from this technology.”
The symbols are automatically mapped to verified IPC-compliant footprints. The designer can then download the ready-to-use symbol and footprint for their desired PCB design software.
Supported formats include Altium, Autodesk Eagle, Mentor PADS & DXDesigner, Cadence OrCad and Allegro, KiCad, and PCB123. For most parts, the process takes less than 5 minutes.
If a part is already available in SnapEDA’s vast component library, then the part can simply be downloaded free from the SnapEDA website instantly, or from within Altium, Eagle, or PCB123 using one of the SnapEDA plugins.
InstaBuild is free, and can be accessed from supported part pages on SnapEDA. To learn more click here.
SnapEDA is building the canonical library for circuit board design. By providing ready-to-use building blocks for design, its library shaves days off of product development, allowing designers to focus on optimization and innovation. Over 60,000 hardware designers worldwide rely on SnapEDA to design faster, whether they’re making smartwatches, drones or robots. Based in San Francisco, the company is funded by Y Combinator and private investors. Visit www.snapeda.com.
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.