Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Koh Young Expands AOI Capabilities to Backend Process
November 9, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will demonstrate new backend process AOI capabilities with the KY-P3 3D pin inspection solution at productronica 2017, which will be held on November 14-17 in Munich, Germany. Koh Young will be in Hall A2 Booth 377.
Using its world-class 3D AOI technology as the foundation for development, Koh Young designed the KY-P3 to overcome longstanding industry challenges like lengthy programming time and high false call rates. Following its guidance, the new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit and more pin configurations as well as applications like Final Optical Inspection (FOI) for engine control units. The system also measures pin height, solder height and pin tip separation with accuracy and repeatability.
Beyond pin measurement and inspection capabilities, the new KY-P3 incorporates the latest technologies to make programming faster and easier. The Koh Young Artificial Intelligence-driven Auto Programming software allows users to quickly generate inspection condition setting using our leading-edge Artificial Intelligence engine and optimized graphical user interface.
The known leader in electronics measurement and inspection, Koh Young is expanding its technology beyond the PCB industry. For example, the new MOI (Machining Optical Inspection) system is quickly being adopted by some of the industry’s largest smartphone makers. Koh Young is achieving its guiding vision “Measure Everything, Everywhere.”
As the absolute leader in the SPI and AOI market, Koh Young will display a broad display innovations, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2, you can learn more about Koh Young Technology and its best-in-class inspection solutions here.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.