-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
New Software Toolkit, CFX Messaging Library Expedites Connected Factory Exchange Implementation
November 13, 2017 | IPCEstimated reading time: 2 minutes
IPC – Association Connecting Electronics Industries, is proud to announce that through today’s donation and legal transfer of a technology from Aegis Software, the industry will have an open-source engineering toolkit that simplifies and expedites both CFX (connected factory exchange) data message creation, and message communication from machine-to-machine and/or machine-to-broker in a CFX network.
The software toolkit, called the CFX Messaging Library, will post to a public open-source website where software developers at machine vendors, software vendors, and manufacturers are free to contribute, evolve, and expand its functionality to make it an even more useful tool for the only standards-based factory data communication solution for the industry.
David Bergman, IPC vice president of standards and training said, “IPC appreciates the contributions of Aegis Software to the IPC CFX standard effort. The donation of this toolkit will pave the way for quicker adoption of the IPC CFX standard in support of Industry 4.0.” The Connected Factory Initiative is growing rapidly with committee members representing software vendors, tier one EMS and OEM manufacturers, and machine and device vendors.
The committee’s work is leading to the creation of a modern, Industrial Internet of Things (IIoT) method for creating factory data exchange in an elegant, cost effective, open, and free manner. The Initiative has already established the encoding format to be used, the data communication technology, and the content structure for the messages. Leading up to productronica, vendors from across the spectrum have been contributing their expertise on the data content specific to their equipment. Productronica 2017 will see the merging of many of these data sets and further agreement toward final adoption of the IPC CFX standard.
The CFX Messaging Library is a Microsoft .Net based programming library which will ease the burden of development for companies wanting to connect their equipment and software systems to the IPC Connected Factory Exchange messaging network. The CFX Messaging Library consists of two parts: One, a collection of data objects representing the standardized CFX messages and Two, a collection of classes to facilitate the transmission and receipt of CFX messages using the committee-agreed OASIS AMQP1.0 message wire protocol.
Jason Spera, CEO of Aegis Software commented, “The keys to widespread adoption and speed of adoption of a messaging standard to support the creation of real Industry 4.0 factories is the ease with which machine vendors, software vendors, and manufacturers can actually implement connection to a CFX network. There can be no requirement for third-party tool investments or licensing costs, and engineering implementation of the communication itself must be simple and fast.
“Aegis is pleased to donate this technology and looks forward to it eliminating both the learning curve that would otherwise be involved in implementing a messaging technology and the creation of properly formed messages themselves,” Spera added.
For more information on the 2-17 Connected Factory Initiative Subcommittee and the evolving standard, click here.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4200+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Atlanta, Ga.; Washington, D.C.; Taos, N.M.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.