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Dr. Jennie Hwang to Deliver Two PDCs at IPC APEX

02/04/2025 | Dr. Jennie Hwang
Dr. Jennie Hwang, Chair of the AI Committee of National Academies/DoD AI study, Chair of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course. 

TopLine Bringing Answers, New Ideas to APEX 2025

02/04/2025 | TopLine
TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.

Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025

02/04/2025 | SolderStar
Solderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.

Rehm Thermal Systems: Future Technologies for Coating, Dispensing and Vapour Phase Soldering Live at IPC APEX EXPO 2025

02/04/2025 | Rehm Thermal Systems
IPC APEX EXPO 2024, which takes place from 18 to 20 March at the Anaheim Convention Center in California, is the largest and most important trade fair for electronics manufacturing in North America.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
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