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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Register for Nine Dot Connects' 1/31 Webinar: Double Data Rate Memory (DDR3)
January 17, 2018 | Nine Dot ConnectsEstimated reading time: 1 minute
There’s a lot of talk about the 3rd generation of Double Data Rate memory known as DDR3. We at Nine Dot Connects have laid out several DDR3 boards in the past three months. There is quite a bit of detail to know about DDR3 design and layout and unfortunately, there is also a lot of misinformation out there. We have waded though and analyzed the literature. We wish to share our findings and understanding with you in our latest webinar series, Double Data Rate (DDR3) Shouldn't be Double Trouble.
In our two-part series on this topic, we will first cover key concepts necessary for proper signal integrity and general DDR3 design. Topics to be covered this month are:
- Brief history of the DDR concept
- Comparison between the different generations of DDR
- The signaling and timing requirements for DDR3
- Understanding match length versus match delay
- Compensating for typical routing delay
- Using the iCD Stackup Planner to assist in delay matching calculation
In part 2, we will build upon this foundation by demonstrating the practical aspects of DDR3 layout techniques.
This latest webinar, Double Data Rate (DDR3) Shouldn't be Double Trouble, is scheduled for January 31, 2018 at 2 pm Eastern Time. For more information and to register, click HERE.
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New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.