-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Launches HyperLynx Solution with Automated and Intelligent Channel Extraction for SerDes Interfaces
February 13, 2018 | Mentor, a Siemens businessEstimated reading time: 3 minutes

Mentor, a Siemens business, today announced its new HyperLynx printed circuit board (PCB) simulation technology for high-performance designs, now providing the industry’s first end-to-end fully automated serializer/deserializer (SerDes) channel validation solution. Today’s advanced electronics products require intelligent high-speed design tools to ensure that designs perform as intended. With signaling rates of 50 Gbps becoming commonplace, and protocols like Ethernet, pushing 400 Gbps bandwidth, traditional methods are insufficient. This is crucial for industries that demand superior high-speed performance such as automotive, networking, data centers, telecom, and IoT/cloud-based products.
SerDes refers to the interfaces like PCI Express (PCIe) that are used anywhere high-bandwidth is required. However, today’s hardware engineers lack time to fully understand the detailed signal integrity requirements of these interface protocols and may have limited access to signal integrity (SI) and 3D EM experts for counsel. Mentor’s new HyperLynx release provides tool-embedded protocol-specific channel compliance— the industry’s first fully automatic validation tool for PCB SerDes interfaces. This includes a 3D explorer feature for design and layout optimization of non-uniform structures like breakouts and vias.
Mentor customer Sintecs, an electronic design service (EDS) company based in The Netherlands, specializes in complex board design and analyses. They developed the European-funded multi-board dReDBox, a completely new concept for a “data center in a box,” with disaggregate processing and memory resources connected with high-speed links (www.dredbox.eu). Using the HyperLynx DDRx Wizard and new SerDes Compliance Wizard, Sintecs could quickly explore the available design space to converge on a physical implementation that met industry standard compliance metrics for their product’s DDR4 (running at 2666 MT/s) and many PCIe3 interfaces. The new HyperLynx intelligent channel extraction tool helped compress the SerDes interface design schedule by automating the entire channel decomposition and modeling design task. Automated channel extraction was substantially faster than Sintecs’ previous manual method that required time from a 3D full-wave solver expert to model each channel discontinuity.
“We've successfully used HyperLynx to achieve the ‘first-time-right’ implementation of our high-speed DDR4 and PCIe SerDes interfaces for the dReDBox project,” stated Hans Klos, managing director of Sintecs B.V. “We’ve changed our way of working, and now our hardware designers and SI engineers use the SerDes Compliance Wizard to quickly iterate during interface design optimization, and final interface compliance verification.”
Protocol-specific Channel Compliance
Using the new HyperLynx release, hardware engineers can easily perform protocol-specific compliance checks. The tool provides embedded protocol expertise for PCIe Gen3/4, USB 3.1, and COM-based technology for Ethernet and Optical Implementers Forum (OIF). Engineers can easily perform equalization optimization (CTLE, FFE, DFE) based on protocol architecture and constraints.
“As data rates in high speed serial links increase, designing channels with acceptable bit error ratios, limited by equalization settings within a protocol’s range, requires a higher level of expertise. The new automated channel analyzer from Mentor is like having an expert on your shoulder. Running the analysis of a design before sign-off will catch many materials, vias and transmission line problems before they sneak into the final design,” said Eric Bogatin, dean of the Signal Integrity Academy and director of the Teledyne LeCroy Front Range Signal Integrity Lab. “And, for the final channel, the new compliance analyzer will recommend the optimized equalization settings to meet the protocol’s constraints. These innovations will help all hardware engineers sleep better at night.”
HyperLynx 3D Explorer
The 3D Explorer feature provides channel structure design and pre-layout optimization. Template-based 3D structure synthesis can be used for differential pair, BGA breakouts, via configurations, series-blocking capacitors, and more.
Product Availability
The new HyperLynx release with automated SerDes channel validation will ship at the end of February 2018.
About Mentor, a Siemens business
Mentor, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. For more information, click here.
Suggested Items
Molex Releases New Report on Strategies for Advancing Rugged, Reliable Connectivity in Modern Aerospace and Defense Applications
04/01/2025 | MolexMolex, a global electronics leader and connectivity innovator, has released a new report from AirBorn, a Molex company, which explores the unrelenting demands for constant, continuous connectivity to support the rigors of modern aerospace, defense and space-industry applications.
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
03/31/2025 | PRNewswireThe growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/28/2025 | Andy Shaughnessy, I-Connect007I’ve spent my week recovering from a busy and interesting week in Anaheim for the 25th IPC APEX EXPO. I think back to my first APEX EXPO, and the changes since then are too numerous to count. I first attended in 2004, also in Anaheim, back when there was almost no design content in the conference or expo portions of the show. It was just a few years after the downturn, and attendees and exhibitors alike were skittish, almost afraid to show confidence in our industry. A few unemployed design friends handed out copies of their resumes. Travel budgets were still down, and the aisles weren’t exactly packed with traffic.
It’s Only Common Sense: 7 Tips to Focus on What Works
03/31/2025 | Dan Beaulieu -- Column: It's Only Common SenseIn business, there’s always the temptation to be all things to all people, whether it’s expanding product lines, chasing every lead, or trying to keep up with competitors. The fear of missing out can lead to spreading our time, resources, and energy too thin. However, success doesn’t come from doing everything; it comes from doing the right things well.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.