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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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EIPC SpeedNews: News from the European PCB Industry
February 15, 2018 | EIPCEstimated reading time: Less than a minute
- Review: EIPC Winter Conference Lyon
- Proceedings Conference Lyon Free of Charge by EIPC members
- New Date and Location of EIPC 50th Anniversary Conference: June 21–22, 2018, Geldern, Germany
- Smart Systems Integration 2018: Program Highlights for Visitors
- Cryptocurrency Craze Boosts Demand for Memory Chips
- DYCONEX Opts for Automated Guided Vehicles
- SCS Partners with DTI to Sponsor UK Electronics Industry at International Events
- 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12; First day at Merlin PCB, Deeside, and then at Chester University
- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at IPC APEX EXPO 2018
- Atotech to Present and Exhibit at the IPC APEX Expo 2018
Suggested Items
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
12/17/2024 | Ventec International GroupVentec International Group Co., Ltd. announces that Thailand has been selected as the location for its new state-of-the-art PCB materials manufacturing facility.
Ventec to Become Primary PCB Materials Supplier for Teltonika
11/13/2024 | VentecVentec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.
Ventec Promotes Bill Wang to Group Technical Vice President
10/14/2024 | VentecVentec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.
Ventec Consolidates and Upgrades European Production and Logistics Center in Germany
10/10/2024 | VentecVentec International Group has begun consolidating operations and installing new, state-of-the-art facilities at its European production and logistics hub in Kirchheimbolanden, Germany.