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BTU to Show the PYRAMAX 125N Dual Lane Reflow Oven at productronica China
February 20, 2018 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc. will exhibit at productronica China, scheduled to take place March 16-18, 2018 at the Shanghai New International Expo Centre. The company will showcase the PYRAMAX 125N Dual Lane Reflow Oven in Booth # E2, 2120 in the SMT Innovation Area.
BTU’s PYRAMAX reflow oven is widely recognized as the performance leader in the reflow oven category. The exclusive closed-loop convection ensures process repeatability site-to-site, line-to-line and oven-to-oven regardless of altitude or other factors. The PYRAMAX family of reflow ovens also includes the Pyramax Vacuum to eliminate solder voids, the Pyramax ZeroTurn dual chamber reflow oven to eliminate changeover time, and the Pyramax TrueFlat for substrate flatness.
The PYRAMAX is powered by the WINCON oven control system. WINCON is an advanced windows-based software system for controlling the operation of BTU thermal processing equipment. It combines both the simplicity of a graphical user interface with powerful diagnostic and analytical tools.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is here.
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.