-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Mycronic to Showcase Latest Solutions at IPC APEX EXPO 2018
February 22, 2018 | Mycronic ABEstimated reading time: 4 minutes
Mycronic AB will demonstrate its growing range of next-generation line automation, dispensing and inspection solutions for just-in-time electronic assembly at IPC APEX EXPO 2018 in San Diego. Mycronic will be in Booth 3511.
Inspection solutions became part of Mycronic's product portfolio with the acquisition of Vi TECHNOLOGY. Headquartered in France, Vi TECHNOLOGY is a leading provider of 3D optical inspection solutions. By combining next-generation 3D inspection with its latest product pick-and-place and jet dispensing platforms, Mycronic can now offer the most complete solution for tomorrow’s intelligent factory.
Growing Range of Solutions on Display
Products on display at IPC APEX EXPO 2018 will include the new MY300 pick-and-place solution, MY700 high-speed jet printer for solder paste and assembly fluids, 3D inspection systems, a new higher-capacity small-footprint storage tower as well as versatile dispensing and conformal coating equipment.
Automating for Tomorrow – Today
"Our ambition is to deliver complete, robust and intelligent software-driven automation solutions for the smart factories of today and tomorrow," says Thomas Stetter, Sr VP General Manager Assembly Solutions. "Our R&D efforts are aimed at improving virtually every stage of fully automated in-line assembly. This means customers can rest assured they’ve got future-proof solutions to meet the trend towards extensive product mixes, shorter series production and product life cycles, as well as smaller components and increasingly complex circuit boards."
The Fully Automated MYPro Series Production Line
For the highest levels of SMT automation, Mycronic is introducing its next-generation MYPro series production line. Completely software-driven and operator-independent, the MYPro series combines comprehensive factory connectivity and real-time data into a single, fully automated production solution. The MYPro production solution comprises:
- MY700 jet printer and dispenser, which jets both solder paste and a wide range of adhesive and assembly fluids at the industry’s highest speeds.
- MY300 pick-and-place machines, which deliver higher real speeds and expanded feeder capacity within a 40% smaller machine footprint than previous generations.
MY700 – Solder Paste and adhesive jetting with twice the possibilities
The MY700 combines a new dual-lane, dual-head design with high-speed, state-of-the-art jetting heads. The dual-head design covers the widest possible range of solder paste dot volumes for small and very large components, or can be configured to jet two different types of media. The machine’s dual-lane capability ensures a non-stop flow of multiple boards with no operator intervention.
MY300 – Higher Productivity with a 40% Smaller Footprint
The new MY300, available in three models, expands capacity up to 224 feeder positions within a 40% smaller footprint than previous models. Higher real speed is enabled due to a number of performance enhancements including automatic conveyor width and job selection, as well as faster tool changes, which occur while the other head is mounting. Fully automated board train functionality is now standard, significantly increasing throughput due to simultaneous loading and unloading of multiple boards.
SMT Line Solution Extended with Next Generation 3D Inspection Systems
“Our recent acquisition of Vi TECHNOLOGY allows Mycronic to extend its product offering of advanced SMT production equipment to include a portfolio of next generation 3D inspection systems and process improvement software,” says Thomas Stetter. He notes that the new inspection system will include the PI series for 3D solder paste inspection (SPI), the K series for 3D automated optical inspection of circuit boards (AOI) as well as the ground-breaking software suite SIGMA Link.
New Higher-capacity SMD Tower 8000 Storage System
To help assemblers cope with tighter floor space constraints and a need for increasingly efficient component storage, Mycronic will also unveil its latest near-production storage system called the SMD Tower 8000. The new unit is taller than previous models and allows for a 17% increase in feeder capacity in the same footprint. The new tower provides an automatic, highly efficient cassette-free component retrieval system close to the production line for quick and smooth changeovers.
New MYSmart Series for Dispensing and Coating
Finally, with the MYSmart series, Mycronic has significantly expanded its capabilities to become one of the world’s largest suppliers of advanced dispensing and conformal coating equipment for the electronics industry. At APEX, Mycronic will exhibit a range of new MYSmart series solutions, including compact tabletop dispensers, versatile conformal coating systems and in-line dispensing equipment. The expanded product portfolio provides manufacturers with a wide selection of cost-efficient solutions for enhanced control of dispense precision, coating area and thickness, process speed, and more.
To view the new MYPro series and MYSmart series, and to explore the advantages of Mycronic’s advanced automation solutions, next generation 3D solder paste inspection systems and improved SMD Tower 8000 storage system, visit Booth 3511 at 2018 IPC APEX EXPO in San Diego on February 27 – March 1, 2018. Visitors interested in the complete range of state-of-the art 3D inspection technology are welcome to visit Vi TECHNOLOGY at Booth 3707, which is located next to the Mycronic booth.
About Mycronic AB
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, Taiwan, United Kingdom and the United States. For more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.