-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
BTU to Demo New Technology at NEPCON China 2018
March 30, 2018 | BTU International, Inc.Estimated reading time: 1 minute
BTU International Inc. will exhibit at NEPCON China 2018, scheduled to take place April 24–26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and PYRAMAX 125N Reflow Oven in Stand 1F25.
"We've expanded our offerings significantly this year, not only increasing our software capabilities to further satisfy Industry 4.0 but to also use PYRAMAX technology to solve process problems such as voiding and substrate warpage," said Bob Bouchard, corporate marketing manager for BTU. "We're excited to share these developments with our customers."
Profile Guardian pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline – independent from control TCs. The redundant process monitor is aware of oven state (recipe change, energy savings modes, etc.), and monitor data can be included in host communications (MES) from the oven. Additionally, it provides board level traceability when paired with bar code readers, which is a requirement for many large OEM/EMS customers.
The PYRAMAX 125N features a 24" width process chamber enabling the processing of large boards for LED and other applications. The PYRAMAX family of reflow ovens also includes the PYRAMAX Vacuum to eliminate solder voids, the PYRAMAX ZeroTurn dual chamber reflow oven to eliminate changeover time, and the PYRAMAX TrueFlat for substrate flatness.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Indium to Feature Thermal Materials Solutions for High-Performance Computing at SC25
11/13/2025 | Indium CorporationAs one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability products at The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC25), taking place November 16-21, in St. Louis, Missouri.
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain
10/20/2025 | BTU International, Inc.BTU International, a leading global supplier of advanced thermal processing equipment for electronics assembly, today announced plans to expand its manufacturing operations into Singapore.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.