SEMI has announced that in 2017 the global semiconductor materials market grew 9.6% while worldwide semiconductor revenues increased 21.6% from the prior year.
According to the SEMI Materials Market Data Subscription, total wafer fabrication materials and packaging materials totaled $27.8 billion and $19.1 billion, respectively, in 2017. In 2016, the wafer fabrication materials and packaging materials markets logged revenues of $24.7 billion and $18.2 billion, respectively, for 12.7% and 5.4% year-over-year increases.
For the eighth consecutive year, Taiwan, at $10.3 billion, was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base. China solidified its hold on the second spot, followed by South Korea and Japan. The Taiwan, China, Europe and South Korea markets saw the strongest revenue growth, while the North America, Rest of World (ROW) and Japan materials markets experienced moderate single-digit growth. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)
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SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, click here.