-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Updated Program for EIPC 50th Anniversary Conf Now Available
May 22, 2018 | EIPCEstimated reading time: 1 minute

The past, the present and the future—these the three elements of EIPC’s 50th anniversary conference being held in Dusseldorf in June this year. Half a century has passed since EIPC was founded in the days when the PCB was more than just a commodity.
At the upcoming conference to be held in Dusseldorf, Germany, there will be a first-class show on June 21–22, with the conference on Day 1 culminating with a visit to Unimicron’s new multilayer factory in Geldern, the Tate Modern of the European PCB industry. This will be followed by a celebration dinner at the 14th Century listed and moated Walbeck Castle.
Day 1 will be the occasion in which Paul Waldner looks back over 50 years in the industry, while Hans Friedrichkreit unveils his metric crystal ball to compete with the imperial one that Walt Custer usually produces. From then on, there will be a wealth of technological discussions on topics such as traceability, PCB 4.0, and halogen-free laminates.
Day 2 is dedicated to flex for 5G, curved and stretchable PCBs, open-source language, organic surface preservatives, and lab-on-PCB technology, as well as the traditional glimpses into developments in applications, chemistries and supply chain management.
For the updated detailed conference program, click here.
For the conference registration form, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Optimum Energy Powers Up Partnership with Conference USA
10/17/2025 | BUSINESS WIREOptimum Energy, a leading energy as a service provider for higher education, announced it will serve as a premier corporate sponsor for Conference USA (CUSA).
Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
09/22/2025 | Global Electronics AssociationThe Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.