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Suggested Items

Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage

08/14/2025 | Markus Voeltz -- Column: Global PCB Connections
Designers don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.

A Plan for Floor Planning: Design007 Magazine August 2025

08/08/2025 | I-Connect007 Editorial Team
Floor planning is full of potential pitfalls—but don’t worry. This month’s contributors share best practices and actionable strategies to help you avoid that dreaded 5:30 p.m. Friday call from the fabricator. Engineers have to weigh dozens (sometimes hundreds) of tradeoffs to balance electrical performance with physical and cost constraints. The decisions made here ripple through the rest of the project: stackup choices can come back to haunt you, and component placement can impact signal integrity, routing efficiency, and overall manufacturability. And as pitch shrinks, the margin for error disappears.

iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.

08/01/2025 | PR Newswire
iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF  specialist, Richardson Electronics.

Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025

07/31/2025 | Nordson Corporation
Nordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.

Connect the Dots: Sequential Lamination in HDI PCB Manufacturing

07/31/2025 | Matt Stevenson -- Column: Connect the Dots
As HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
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