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Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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DownStream Technologies Present Two Webinars in June
May 30, 2018 | DownStream TechnologiesEstimated reading time: Less than a minute
If you haven't seen DownStream’s software solutions, here are a few great opportunities to watch them live. During these two webinars, attendees will witness all DownStream has to offer.
Technical staff will walk you through the DFM solution designed to streamline the process between design and fabrication. DFMStream will help designers to create flawless designs that get through production the first time, saving you time and money.
Attendees will also learn how BluePrint-PCB will automate and streamline your PCB Documentation efforts. It eases the creation while making them easier to share, utilize, and update.
Wednesday, June 12
CAM350/DFMStream: Create Flawless Designs While Streamlining the Process
To register for this webinar, click here.
Thursday, June 13
BluePrint-PCB: Automate and Perfect PCB Documentation
To register for this webinar, click here.
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Brent Fischthal - Koh YoungSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
A Plan for Floor Planning: Design007 Magazine August 2025
08/08/2025 | I-Connect007 Editorial TeamFloor planning is full of potential pitfalls—but don’t worry. This month’s contributors share best practices and actionable strategies to help you avoid that dreaded 5:30 p.m. Friday call from the fabricator. Engineers have to weigh dozens (sometimes hundreds) of tradeoffs to balance electrical performance with physical and cost constraints. The decisions made here ripple through the rest of the project: stackup choices can come back to haunt you, and component placement can impact signal integrity, routing efficiency, and overall manufacturability. And as pitch shrinks, the margin for error disappears.
iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.
08/01/2025 | PR NewswireiDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.