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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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DownStream Technologies Present Two Webinars in June
May 30, 2018 | DownStream TechnologiesEstimated reading time: Less than a minute
If you haven't seen DownStream’s software solutions, here are a few great opportunities to watch them live. During these two webinars, attendees will witness all DownStream has to offer.
Technical staff will walk you through the DFM solution designed to streamline the process between design and fabrication. DFMStream will help designers to create flawless designs that get through production the first time, saving you time and money.
Attendees will also learn how BluePrint-PCB will automate and streamline your PCB Documentation efforts. It eases the creation while making them easier to share, utilize, and update.
Wednesday, June 12
CAM350/DFMStream: Create Flawless Designs While Streamlining the Process
To register for this webinar, click here.
Thursday, June 13
BluePrint-PCB: Automate and Perfect PCB Documentation
To register for this webinar, click here.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
Liquid AI Raises $250M to Scale Capable and Efficient General-purpose AI
12/16/2024 | Liquid AILiquid AI announces a Series A round of financing with AMD Ventures as strategic lead.
Connect the Dots: Designing for Reality: Strip-Etch-Strip
12/05/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Betamek Berhad Secures MYR 396,420 Government Grant for Digital Transformation
11/27/2024 | BetamekBetamek Berhad has accepted a government grant of MYR 396,420 from the Ministry of Entrepreneur and Cooperatives Development, managed by Malaysia Industrial Development Finance Berhad.