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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
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DownStream Technologies Present Two Webinars in June
May 30, 2018 | DownStream TechnologiesEstimated reading time: Less than a minute
If you haven't seen DownStream’s software solutions, here are a few great opportunities to watch them live. During these two webinars, attendees will witness all DownStream has to offer.
Technical staff will walk you through the DFM solution designed to streamline the process between design and fabrication. DFMStream will help designers to create flawless designs that get through production the first time, saving you time and money.
Attendees will also learn how BluePrint-PCB will automate and streamline your PCB Documentation efforts. It eases the creation while making them easier to share, utilize, and update.
Wednesday, June 12
CAM350/DFMStream: Create Flawless Designs While Streamlining the Process
To register for this webinar, click here.
Thursday, June 13
BluePrint-PCB: Automate and Perfect PCB Documentation
To register for this webinar, click here.
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Sweeney Ng - CEE PCBSuggested Items
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09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Knowledge Base: Cultivating Your Brand in the Age of Connection
08/19/2025 | Mike Konrad -- Column: The Knowledge BaseAudiences have evolved in how they consume information, form opinions, and make purchasing decisions. While marketing still relies on tried-and-true methods—get your name and message in front of your audience—you must also cultivate connection, credibility, and community. Your customers, particularly the younger generation of engineers, buyers, and program managers, want to discover value on their terms.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.