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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Graphene and Flexible Substrates
June 1, 2018 | ICFOEstimated reading time: 1 minute
An international team of researchers reports on a new polymer-free technique for the fabrication of transparent flexible substrates using graphene. Graphene is a unique 2D material that has shown to have amazing properties which include high intrinsic carrier mobility, tunable band gap, high mechanical strength and elasticity, and superior thermal conductivity, among others. Such unique characteristics make graphene a potential material for many applications, for example its implementation for high-speed transistors, energy/thermal management and chemical/biological sensors.
In order to fully exploit the properties of this materials, previous studies have been devoted to understanding how it can be transferable to a wide variety of substrates. Several methods have been developed toward this goal and the most commonly used method is a polymer-assisted transfer process called ‘wet-transfer’. Now, the drawback of this process is that it leaves residues on the substrate, which depose a significant challenge to the fabrication process since it affects the graphene’s electrical and mechanical properties.
In a recent study published in 2D Materials, ICFO researchers Miriam Marchena, Manuel Fernandez, Tong Lai Chen, led by ICREA Prof. at ICFO Valerio Pruneri, in collaboration with researchers led by Dr. Prantik Mazumder and Dr. Robert Lee from Corning Research and Development Corporation, have demonstrated for the first time the direct transfer of graphene from Cu foil to rigid and flexible substrates, such as glass and PET, using as an intermediate layer of thin film of polyimide (PI) mixed with an aminosilane, a process that leaves the substrate free of residues.
With this technique, the team of scientists has obtained as a result a transparent device, thermally stable (350 °C) and free of polymer residue on the device side of the graphene. Their technique is the first step towards making a substrate ready for device fabrication.
The results of the study open a new window toward the use of graphene in the development of devices that can be made smaller and faster when compared to the actual silicon based devices that are beginning to show capability limitations.
Suggested Items
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.