Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

sureCore Now Licensing its CryoMem Range of IP for Quantum Computing

11/26/2024 | sureCore
sureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.

Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4

10/03/2024 |
Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.

Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show

10/01/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in