-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sensible Design: Protecting PCBs from Harsh, Challenging Environments
July 3, 2018 | Alistair Little, ElectrolubeEstimated reading time: 2 minutes
Last month, I began my new series of columns on resins by selecting five frequently asked questions from our customers regarding resin chemistries and properties, and typical resin applications and their limitations. This month, I’m taking this introduction a step further by listing what I believe are the top five tips for circuit designers and manufacturers who seek to ensure that the reliability and longevity of their electronic assemblies and products are fully addressed.
1. Think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes, for example. Your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin. However, such excursions may only be short-lived; under normal operating conditions, the PCB might only be subjected to a maximum temperature of, say, 120°C, opening a wider choice of resin types and methods of application.
In a similar way, the required chemical resistance of your chosen resin will depend on the duration and/or extent of the chemical contamination. For example, there is a considerable difference in terms of the extent of chemical damage between a thin layer of a contaminating chemical on the resin surface that is wiped off within five minutes and 500ml of chemical present on the resin surface for one hour or more—let alone complete immersion! Furthermore, the range of chemicals that a PCB might eventually be exposed to is often quite limited, and almost certainly not the broad range that is frequently listed at the design stage, just to be on the safe side.
2. Environmental factors that normally affect a PCB are temperature, chemical attack, physical shock (vibration) and thermal shock; the trick is to decide which of these is likely to have the greatest impact upon your PCB and then concentrate on making an appropriate resin choice. Each of the three main resin types (epoxy, polyurethane and silicone) have strengths and weaknesses.
Silicone resins have the broadest continuous operating temperature range of any of the resin chemistries, so they are a natural choice for both high- and low-temperature applications, as well as those subject to thermal shock. They also maintain their flexibility over this temperature range with very little sign of degradation over time. On the downside, silicones have poor adhesion on certain substrates and their chemical resistance is not as good as that provided by an epoxy resin.
To read this entire column, which appeared in the May 2018 issue of Design007 Magazine, click here.
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.