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Rising Star Award: Paavo Niskala, TactoTek

04/28/2025 | Nolan Johnson, I-Connect007
Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.

INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b

04/28/2025 | iNEMI
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.

Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability

04/22/2025 | Microchip
The JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.

Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions

04/16/2025 | BUSINESS WIRE
Nortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.

Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe

04/15/2025 | Indium Corporation
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
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