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Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh

05/27/2025 | Polar Instruments
Polar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025.  More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed. 

FastlinkPCB Accelerates Global Expansion, Builds Efficient PCB Industry Chain

05/26/2025 | FastlinkPCB
FastlinkPCB, a PCB manufacturing and assembly solutions provider, announced that it has completed the layout of subsidiaries in the US, Germany, Switzerland, and Malaysia over the past year, forming a localized service network covering North America, Europe, and Southeast Asia.

Defining the Ideal PCB Design Data Output

05/27/2025 | Stephen V. Chavez, Siemens EDA
At the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.

Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

05/22/2025 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.

HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%

05/22/2025 | TrendForce
TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
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